Trending

News

  • 0
  • 0

What are the factors that affect the thermal conductivity of PCB aluminum nitride (AlN) ceramic substrate? aluminum and nitride

If you are looking for high-quality products, please feel free to contact us and send an inquiry, email: brad@ihpa.net



Light weight aluminum nitride (AlN), as a structurally stable hexagonal wurtzite covalently bound compound, has revealed wide application potential in the areas of electronics and optoelectronics as a result of its one-of-a-kind physical and chemical homes. Its crystal framework is based upon an AlN4 tetrahedron as the basic unit, with space team P63mc coming from the hexagonal crystal system. This structure offers AlN a collection of exceptional homes.

Highlight of AlN ceramics

High thermal conductivity: Compared to alumina ceramics, the thermal conductivity of AlN is 5 to 10 times greater. Theoretically, the thermal conductivity of solitary crystal materials at 300K can get to 319W/(m · K).

Thermal development matching: Its thermal growth coefficient resembles that of semiconductor silicon products, which is conducive to gadget assimilation.

Excellent mechanical and electrical homes: It has high insulation resistance and reduced dielectric loss and is suitable for high-reliability digital product packaging.

Practical for multi-layer circuitry: sustains miniaturization and high-density integration of product packaging.

Eco-friendly: The non-toxic features satisfy contemporary environmental protection requirements.

(Aluminum Nitride (AlN) Crystal Structure)

Aspects influencing the thermal conductivity of AlN ceramics

Although the theoretical thermal conductivity of AlN is very high, its efficiency in functional applications is restricted by numerous elements, generally including:

1. Microstructure: Phonon scattering is the key mechanism of heat conduction. Grain borders, interfaces, 2nd phases, problems, and so on, will certainly influence the mean cost-free course of phonons, thus affecting thermal conductivity. High-purity, low-defect single-crystal AlN has a longer phonon-free path and greater thermal conductivity.

2. Oxygen impurity web content: The strong affinity of AlN with oxygen makes it easy to introduce oxygen contaminations, forming aluminum oxide movies and lattice flaws, such as aluminum openings, which considerably decrease the mean cost-free course of phonons and therefore decrease thermal conductivity. When the oxygen concentration is below 0.75%, oxygen atoms mainly replace nitrogen atoms; exceeding this concentration will certainly lead to the disappearance of light weight aluminum jobs and the generation of ductility problems, additionally influencing thermal conductivity.

3. Sintering process and ingredients: By choosing proper sintering ingredients (such as Y2O3-Li2O, Y2O3-CaC2 and various other composite systems), densification sintering can be achieved at a lower temperature level while lowering the development of oxygen impurities and 2nd phases, effectively enhancing the thermal conductivity of AlN ceramics. The role of these additives is to purify the grain boundaries, optimize the microstructure, and facilitate the efficient transmission of phonons.

Comprehensive technique

(TRUNNANO Aluminum Nitride (AlN) Powder)

In order to obtain AlN ceramics with high thermal conductivity, it is required to consider the purity of the material comprehensively, the sintering conditions and the selection of additives to decrease inner problems, specifically to manage the material of oxygen contaminations and maximize the microstructure.

By carefully managing the sintering process and embracing a reliable composite sintering additive system, it is expected that the high thermal conductivity AlN substrate needed for large manufacturing applications can be accomplished while guaranteeing product efficiency. This is not only critical for boosting the heat dissipation performance of digital tools, yet likewise supplies a key product basis for advertising the growth of semiconductor modern technology.

Provider of Aluminum Nitride AlN Powder

TRUNNANO is a supplier of 3D Printing Materials with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you want to know more about aluminum and nitride, please feel free to contact us and send an inquiry.

Inquiry us

High Purity 3D Printing Nickel Alloy IN718 Powder

Metal Alloy High Density Tungsten Alloy Rod Grind Surface Tungsten Alloy Bar

Metal Alloy 8.92g/Cm3 High Purity Polished Copper Plate

Metal Alloy 18g/cm3 High Density Tungsten Alloy Ball

Metal Alloy 18.5g/cm3 Polished Tungsten Heavy Alloy Plate

High Purity Germanium Sulfide GeS2 Powder CAS 12025-34-2, 99.99%

High Purity Molybdenum Boride MoB2 Powder CAS 12006-99-4, 99%

High Purity Nano Hafnium Hf powder CAS 7440-58-6, 99%

High Purity Titanium Sulfide TiS2 Powder CAS 2039-13-3, 99.99%

High Purity Nano Ag Silver powder cas 7440-22-4, 99%

High Purity Chromium Diboride CrB2 Powder CAS 12007-16-8, 99%

High Purity Tungsten Silicide WSi2 Powder CAS 12039-88-2, 99%

High Purity 3D Printing Nickel-based Alloy IN738 Powder

High Purity Calcium Nitride Ca3N2 Powder CAS 12013-82-0, 99.5%

Supply Magnesium Granules Mg Granules 99.95%

High Purity 3D Printing Powder 15-5 Stainless Steel Powder

High Purity Silicon Sulfide SiS2 Powder CAS 13759-10-9, 99.99%

High Purity Colloidal Silver Nano Silver Solution CAS 7440-22-4

High Purity Silicon Nitride Si3N4 Powder CAS 12033-89-5, 99%

High Purity 3D Printing 304 Stainless Steel Powder

Our Latest Products

High Purity 3D Printing Nickel Alloy IN718 Powder

In718 Powder is widely used for industrial and aviation turbo-propellers, petrochemical, nuclear reactors, and laser cladding.Particle Size: 15-45mm; 15-53mm; 53-120mm and 53-150mm 3D Printing Nickel Alloy Inconel 718 Properties: Nickel Alloy IN…

Metal Alloy High Density Tungsten Alloy Rod Grind Surface Tungsten Alloy Bar

Tungsten-nickel-copper/iron alloy is characterized by low thermal expansion, high density, radiation absorption and high thermal and electrical conductivity. It is widely utilized in the aerospace and medical industries. About High Density Tungsten…

Metal Alloy 8.92g/Cm3 High Purity Polished Copper Plate

Copper products exhibit good electrical conductivity as well as thermal conductivity. They are also ductile, resistant to corrosion, and have a high wear resistance. They are widely used by the energy, petrochemical, e-commerce, and electronics indus…